OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today unveiled the OCZ Apex SATA II 2.5” Solid State Drive (SSD) Series, the affordable midrange offering for enthusiasts, system builders, and mainstream computer users demanding the latest technology in this fast-developing sector of the storage market. This cost-efficient SSD offers a reliable upgrade from traditional hard disc storage while maintaining a price point that is truly within the reach of a wide range of consumers.“As the adoption of SSD drives continues to ramp, it is our goal to enable everyday consumers to take advantage of the benefits of solid state drives,” said Eugene Chang, Director of Product Management at OCZ Technology Group. “The new Apex Series is positioned at the center of our lineup and features an updated controller and internal RAID design to deliver superior performance to mainstream consumers at a very aggressive price.”
Offering your notebook or desktop system the incredible benefitsof flash-based technology, The OCZ Apex Series delivers the performance and reliability of SSDs at less price per gigabyte than other high speed offerings currently on the market. The OCZ Apex Series is the result of all the latest breakthroughs in SSD technology, including new internal RAID 0 architecture, updated controller design, and speedy 230MB/sec read and 160MB/sec write speeds. With its three levels of solid state offerings, the Apex will be positioned between the premium Vertex Series and the value oriented Solid Series. OCZ continues to place flash mass storage technology within reach of the average consumer with the Apex Series and delivers on the promise of SSDs as an alternative to traditional hard drives in consumer targeted mobile applications.
The Apex Series is ideal for energy-efficient mobile computing to extend battery life for notebooks with low power consumption, increase access time, and provide a durable alternative to conventional hard disc drives with superior shock resistance. With fast access and seek times combined with excellent reliability, the OCZ Apex Series SSDs are the answer for consumers demanding this latest storage technology.
The OCZ Apex Series drives feature a durable yet lightweight alloy housing, and because OCZ SSDs have no moving parts, the drives are more rugged than traditional hard drives. Designed for ultimate reliability, Apex Series SSDs have an excellent 1.5 million hour mean time before failure (MTBF) ensuring peace of mind over the long term. All Apex Series drives come backed a two year warranty and OCZ’s legendary service and support. Apex series SSD drives are available in ample storage capacities of 60GB, 120GB, and 250GB.
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Despite the grim market outlook of NAND Flash-based storage solutions, memory makers continue develop the technology, and to release better and higher-capacity Solid State Drives. On that note, one of the most recent announcements of this kind comes from Patriot Memory, a global provider of premium quality memory module and flash memory solutions.The company has recently introduced its new 256GB Warp SSD v3, which has been designed to boast read and write speeds of up to 240MB/s and 160MB/s, respectively. Basically, the just introduced SSDs will come to boost the storage capacity and the performance capability of today's high-performance computer systems.
“Our new 256GB Warp SSD v3 now gives the consumer the fastest data-transfer rates plus all the storage space largeenough to quench their multimedia thirst,” says Flash Product Manager for Patriot Memory, Meng Jay. “It wasn't long ago that SSDs maxed out at 64GB with read speeds of 130MB/s, now with the Warp v3 we literally 'Warp' into capacities that most consumers demand and speeds far faster than current conventional hard drives.”
The 256GB Warp SSD v3 comes to expand the company's lineup of Flash-based storage products, while also providing users with a high-capacity and high-performance storage solution. The drive boasts a 2.5-inch form factor, and is featured with a SATA connectivity interface. It can easily be considered an alternative storage solution for portable or desktop computer systems, providing fast performance, as compared to that of traditional hard drives. Unfortunately, the company hasn't revealed any details regarding pricing for the newly announced SSD.
Until recently, Patriot's new Warp SSDs would have been considered among the highest capacity Flash-based storage solutions on the market. However, due to Toshiba's 512GB announced earlier today, the SSD market has now been taken to the next level in terms of storage. Still, the adoption rate of SSDs is largely influenced by their price tag, which continues to be considerably higher than that of traditional drives.
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OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the Flex EX memory series, featuring breakneck speeds demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. These premium high-density modules operate at incredibly fast DDR2 and DDR3 speeds to run the latest memory-intensive games and applications, and offer enthusiasts the thermal management necessary for the stability and performance on high-end gaming and overclocking systems.Offering some of the industry’s fastest modules to date, the Flex EX series encompasses the needs of enthusiasts, power users, and gamers with incredible frequencies up to DDR3-2000, and DDR2-1200 as the fastest DDR2 4GB kit available. The Flex EX Series has a specifically tailored configuration for all users to maximize the performance for all types of systems.
“Memory is the primary storage device of any modern computer system and defines how fast the CPU can access data,” commented Dr. Michael Schuette, VP of Technology Development atOCZ Technology. “Density, frequency, and access latencies of the system memory are the critical factors for overall performance of any PC and that is where the new OCZ Flex Ex series sets new standards by providing the optimal combination of the three factors for any system architecture by offering unprecedented speed and latencies at 4GB density with advanced cooling options to enhance stability and performance in even the most demanding environments.”
The OCZ Flex EX thermal management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each Flex EX memory module features the integrated liquid injection system design which originated in the OCZ Flex XLC (Xtreme Liquid Convection) Series. This latest series was engineered with a “flexible” all-aluminum design to give enthusiasts the option to run the modules water-cooled or passively via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
The new Flex EX series will be initially available in these high-end solutions for gamers and overclockers utilizing water or passive cooling:
* OCZ PC2-9600 Flex EX 4GB (2x2GB) 1200MHz CL 6-6-6-18 @ 2.2V
* OCZ PC2-6400 Flex EX 4GB (2X2GB) 800MHz CL 4-4-3-15 @ 2.1V
* OCZ PC3-12800 Flex EX 4GB (2x2GB) 1600MHz CL 7-6-6-24 @ 1.9V
* OCZ PC3-16600 Flex EX 4GB (2x2GB) 2000MHz CL 8-8-8-30 @ 2.0V
The Flex EX modules are optimized for the latest cutting-edge platforms and will be available in 4GB (2x2048MB) dual channel kits for ultimate bandwidth. As part of OCZ’s line-up of premium memory, the Flex EX series is backed by a Lifetime Warranty and industry-leading technical support for unparalleled peace of mind.
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Hynix Semiconductor announced it has developed the world's first 2Gigabit mobile DRAM using 54nm process technology.This product provides twice as much storage capacity over current 1Gb mobile solution which has been the highest density offered among the mobile DRAM products in MCP (Multi Chip Package), PoP(Package on Package) platform. It boasts maximum operating speed of 400Mbps (Megabits per second) at 1.2V power supply and processes up to 1.6 Gigabytes of dataper second with a 32-bit I/O. Moreover, the new product consumes less power than existing memory solutions.
Besides its various features, the new product also has function of Hynix's One Chip Solutions. It offers flexible options for both SDRAM and DDR DRAM interfaces, and both x16 and x32 organizations on a single chip.
The product which meets JEDEC standard is suited for the next generation applications of MID (Mobile Internet Device) and UMPC (Ultra Mobile PC) as well as higher density required products.
Hynix plans to start mass production in the first half of next year.
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Patriot Memory, a global provider of premium quality memory module and flash memory solutions, today announced the release of their Viper series Tri-Channel memory kits designed for the forthcoming Intel® Core™ i7/Intel® X58 Express Chipset. Available in both 3GB and 6GB kits, these newly engineered memory kits come with the award winning Viper series heat shields and are the perfect balance of speed and latency while achieving lower voltage requirements."Intel's® Nehalem architecture shows significant improvements over previous platforms," says Les Henry, Technical Director for Patriot Memory."High performance DDR3 DIMMs from Patriot Memory, combined with the phenomenal memory bandwidth & processing capability of Intel's®upcoming Core™ i7 microprocessors, will deliver exciting levels of performance to PC enthusiasts worldwide," said, Steve R. Peterson, Intel's® Director of Chipset & Graphics Marketing.
PRODUCT INFO:
3GB PC3-12800 Viper Series Low Latency Tri-Channel Kit, 1600MHz (3 x 1GB) 8-8-8-24
6GB PC3-12800 Viper Series Low Latency Tri-Channel Kit, 1600MHz (3 x 2GB) 8-8-8-24
3GB PC3-12800 Viper Series Enhanced Latency Tri-Channel Kit, 1600MHz (3 x 1GB) 9-9-9-24
6GB PC3-12800 Viper Series Enhanced Latency Tri-Channel Kit, 1600MHz (3 x 2GB) 9-9-9-24
3GB PC3-10666 Viper Series Low Latency Tri-Channel Kit, 1333MHz (3 x 1GB) 7-7-7-20
6GB PC3-10666 Viper Series Low Latency Tri-Channel Kit, 1333MHz (3 x 2GB) 7-7-7-20
3GB PC3-10666 Viper Series Enhanced Latency Tri-Channel Kit, 1333MHz (3 x 1GB) 9-9-9-24
6GB PC3-10666 Viper Series Enhanced Latency Tri-Channel Kit, 1333MHz (3 x 2GB) 9-9-9-24
The Viper series Tri-Channel kits will also include Intel's® newest XMP settings for Core™ i7 processor based platforms. When enabled, XMP settings allow easy, uncomplicated overclocking on Intel's® X58 Express chipsets.
Patriot will also offer a 3GB and 6GB PC3-10666 1333MHz CL9 Tri-Channel kit for their Signature Line for entry level consumers looking to experience Intel's® newest platform.
Patriot's Tri-Channel solutions are manufactured and tested for quality and compatibility as a kit in our USA manufacturing facility located in Fremont, CA.
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A-DATA Technology Co., Ltd., a worldwide leading provider of high performance memory products, announced the launch of its A-DATA XPG DDR3-1800+ memory modules included in its Plus Series, which also comprises the company's DDR3-1600+ memory kits. The new DDR3-1800+ modules are available in dual channel kits, 1GBx2 and 2GBx2, as well as in triple channel retail packs as 2GBx3 and 1GBx3.The incredible 1800MHz speed of the memory kits is complemented by the CL8-8-8-24 timings, which are able to offer leveraged performance to high-end systems. Moreover, the high-frequency memory modules are designed to operate while balancing great speeds, low power consumption and low latencies without turning hot, courtesy of the innovative aluminum heatspreaders they sport.
The company announced that the 2GB/4GB dual channel module kits were tested at 1800MHz, the same as the 3GB/6GB triple channel ones. Moreover, the provider also specified that tests were made at latency settings 8-8-8-24 at 1.65V-1.85V. The specification list of the memory modules also includes SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.The feature list of the new A-DATA XPG DDR3-1800+ memory modules includes:
- all memory chips are verified using overclocking criteria for better quality;
- high quality 6 layers PCB (Printed Circuit Board);
- optimizations for 64-bit OS;
- backward compatibility with DDR3-1600, 1333 and 1066;
- lifetime limited warranty.
A-DATA has managed to build in time a reputation of a provider of consistently high quality. The DDR3-1800+ kits have passed burn-in testing and rigorous capability testing meant to ensure stable operation over extended periods of usage. The A-DATA Plus Series is meant to provide the performance, compatibility, and stability PC enthusiasts and gamers are seeking, and it is able to satisfy their needs in terms of high-performance modules.
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Elpida Memory, a Japanese global supplier of Dynamic Random Access Memory (DRAM), announced today having managed to complete the development of a 50 nanometer process DDR3 SDRAM. According to the company, the new DRAM is characterized by a very low power consumption, but can reach 2.5Gbps ultra high speed and a 1.2V low voltage operation based on the industry's smallest chip size.The company has developed the 50nm process DDR3 SDRAM while using the 193nm (ArF) immersion lithography technology and copper interconnect technology. The size of the new chip is less than 40mm2. Moreover, the company says that the SDRAM can operate not only at the standard 1.5V supply voltage of the DDR3 modules, but also at even lower voltages of 1.35V and 1.2V. The product contributes to the low-power operations of high-density memory systems including servers and data centers.The new 50nm process DDR3 SDRAM can deliver data transfer rates of 800Mbps, 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps and 2500Mbps, while operating at 1.2V, 1.35V and 1.5V voltages. The product features low electric current which delivers a maximum 50 percent reduction (IDD4) compared to 70 nanometer process DRAM.
The company announced that the DDR3 SDRAM would initially be used in applications for high-end desktop PCs. The product will be used in other applications as well, considering the current shift away from DDR2 SDRAMs in notebook PCs and server equipment. Also, the company plans entering mass production with the new 50nm process DDR3 SDRAM at some point in the January-March 2009 time frame.
Elpida Memory, the leading manufacturer of DRAM integrated circuits, has a world class expertise in design, manufacturing and sales operations. It uses the most advanced manufacturing technologies available with its 300mm manufacturing facilities. More information on both Elpidia and its advancements in technology are available on the company's site.
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Hynix this week double-dipped into the record books by introducing the world's first and fastest 1 Gigabit GDDR5 graphics DRAM operating at 7Gb/s, a 40 percent improvement over 5Gb/s GDDR5. The new memory is built using a 54nm process and can process up to 28GB/s with a 32-bit I/O, the company claims. On a 512-bit memory bus, bandwidth should reach as high as 448GB/s.In addition to speed, Hynix also emphasized power consumption. The new memory requires just 1.35V as opposed to 1.5V inherent in previous generation GDDR5 memory. This means that the improved GDDR5 not only bodes well for future high performance videocards, but the potential for lower heat and longer battery life could also be a boon for notebooks.Hynix says its 1Gb GDDR5 graphics memory meets the JEDEC standard and plans to start volume production in the first half of 2009.
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Mushkin Announces Triple-Channel Memory Kits for the Intel Core i7 PlatformDENVER, November 17, 2008 – Mushkin, Inc. (www.mushkin.com), a global leader in high-performance memory products, today announced the release of its triple-channel memory kits designed specifically for the new Intel® Core i7TM platform. The flagship offering of the new memory kits is the XP3-12800 7-8-7, allowing end users to extract higher performance at 1600MT/s than competitors’ products while staying within safe operating voltages. Additionally, early adopters of the new platform will find Mushkin’s triple-channel products stable and reliable, ensuring a trouble-free migration.
“We’ve worked diligently to create parts for the Core i7 platform that push specifications to unprecedented levels while maintaining the high quality and reliability standards of our existing products,” said Brian Flood, director of product development for Mushkin. “Our triple-pack customers will be rewarded with the utmost reliability from our standard rated products, and greatly increased performance from our high performance line.”
Part Numbers:
998674 – 3GB (3x1GB) XP3-10666 6-6-6-18 1.65V
998675 – 6GB (3x2GB) XP3-10666 6-6-6-18 1.65V
998676 – 3GB (3x1GB) HP3-10666 7-7-7-20 1.5-1.6V
998677 – 6GB (3x2GB) HP3-10666 7-7-7-20 1.5-1.6V
998583 – 3GB (3x1GB) EM3-10666 9-9-9-24 1.5V
998585 – 6GB (3x2GB) EM3-10666 9-9-9-24 1.5V
998678 – 3GB (3x1GB) XP3-12800 7-8-7-20 1.65V
998679 – 6GB (3x2GB) XP3-12800 7-8-7-20 1.65V
998680 – 3GB (3x1GB) XP3-12800 8-8-8-24 1.6-1.65V
998681 – 6GB (3x2GB) XP3-12800 8-8-8-24 1.6-1.65V
998658 – 3GB (3x1GB) HP3-12800 9-9-9-27 1.5-1.6V
998659 – 6GB (3x2GB) HP3-12800 9-9-9-27 1.5-1.6V
998682 – 3GB (3x1GB) HP3-8500 6-6-6-18 1.5-1.6V
998683 – 6GB (3x2GB) HP3-8500 6-6-6-18 1.5-1.6V
998570 – 3GB (3x1GB) EM3-8500 7-7-7-20 1.5V
998571 – 6GB (3x2GB) EM3-8500 7-7-7-20 1.5V
The new triple packs are immediately available at mushkin.com in 3GB (3x1GB) and 6GB (3x2GB) kits. Every module is hand-tested beyond its rated specification and features Mushkin’s FrostByte heatspreader which keeps the modules within safe operating temperatures. Like all Mushkin products, these modules are backed by a lifetime warranty and an industry-leading technical support staff.
About Mushkin
Located at the base of the Rocky Mountains in Denver, Colorado, Mushkin provides performance-enhanced computer products to users worldwide. Mushkin products include an enhanced power supply line and a complete selection of memory upgrades for desktops, servers and notebooks. Mushkin caters to the overclocking community and value segment with its Redline and PerfectMatch products. Since its founding in 1994, Mushkin has received numerous awards and recognitions for quality, reliability, and technical excellence. The 14-year old company is dedicated to helping overclockers, gamers, IT managers, digital artists, and mobile professionals enhance their computing experience by providing reliable, high performance components.
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With the launch of ThinkServers, Lenovo has expanded its popular Think range of enterprise computing solutions in India. Lenovo’s ThinkServer range comprises of ThinkServer TS100 Rack, ThinkServer TD100 Tower, ThinkServer TD100x Tower, ThinkServer RD120 Rack and Thinkserver RS110 Rack.The ThinkServer TS100 Tower and RS110 Rack are aimed at small offices for simple applications, whereas the ThinkServer TD100 Tower, TD100x Tower or RD120 Rack is developed for medium-sized businesses that involve additional capabilities. All the ThinkServers come pre-loaded with management tools that include:
# ThinkServer EasyStartup – A hardware configuration tool to get the servers up and running quickly
# ThinkServer EasyUpdate – An update utility to easily identify, download and install hardware and firmware updates
# ThinkServer EasyManage – A full featured tool that works with LANDesk to manage the performance of one or more servers from a single console.The ThinkServer servers work with Microsoft Windows Server or SUSE Linux Enterprise Server from Novell.
All these ThinServers incorporate Easy LED Diagnostics that enables server administrator to easily diagnose hardware issues; and Advanced ECC Memory to smoothly minimize the chances of system downtime due to memory failure.
The ThinkServer TS100 Tower and RS110 Rack are single-socket servers, while the ThinkServer TD100 Tower, TD100x Tower or RD120 Rack are double-socket servers.
The ThinkServer TS100 Tower is powered by Intel Core 2 Duo and Xeon 3200 Series processor and sports Intel 32101CH9R chipset, an 8 GB Memeory, SS/HS 4×3.5″ SATA/SAS or HS 8×2.5″ SAS storage, CDRW/DVDROM drives and ATI ES1000 graphics with external DDRII 64 MB memory.
Powered by Intel Xeon 3000 and 5000 series processor, the ThinkServer TD100/TD100x Tower features Intel 5000 ICH7R chipset, a 32GB/48GB Memory, SS/HS 4×3/5″SAS or SATA OR SS/HS 8×3.5″ SAS or SATA storage, CDRW/DVDROM drives and ATI ES1000 graphics with external DDRII 64 MB memory.
Next is the Thinkserver RS110 Rack that comes equipped with Intel Celeron, Pentium Dual, Core 2 Duo/Quad and Xeon 3000 Series processor, Intel 3210ICH9 chipset, an 8 GB memory, SS/HS 2×3.5″ SATA/SAS or SS/HS 4×2.5″ SAS storage, CDRW/DVDROM drives and ATI ES1000 with DVO graphics.
Lastly, the ThinkServer RD120 Rack employs Intel Xeon 3000 and 5000 processor, Intel 5000 ICH7 chipset, a 48 GB memory, CDRW/DVDROM drives and a storage options such as 6 x 3.5 inch HS SAS or 4 x 3.5 inch HS SAS Plus tape, 8 x 2.5 inch HS SAS Plus Tape, DDS6 Internal Tape Option supported on either 2.5-inch SAS or 3.5-inch SAS.
Lenovo’s ThinkServers are expected to hit the Indian market by this month for a starting price of Rs 45,000.
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Corsair a worldwide leader in high performance computer and flash memory products, announced today that it is launching a full line of DDR3 performance memory products designed for Intel® CoreTM i7 processor.Corsair will offer memory solutions supporting three different DDR3 memory speeds in triple memory packs: 1333MHz, 1600MHz and 1866MHz. Each memory speed will feature kits of three 1 Gigabyte or 2 Gigabyte modules for a total of 3 Gigabyte or 6 Gigabyte kits. The 1600MHz and 1866MHz DDR3 memory kits will also feature Corsair?s patented Dual-Path Heat Exchange (DHX) technology for maximum performance and reliability.Corsair?s DDR3-1333 part is available immediately in both 3x1GB and 3x2GB densities. With today?s modern programs utilizing more memory than ever before, Corsair recommends 6GB for optimum performance on the Intel CoreTM i7 platform. Next to launch will be the Dominator DDR3-1600MHz kit, with the DDR3-1866MHz kits to follow just before the official launch of the Intel CoreTM i7 processor.
TR3X6G1866C9DF - 6GB Kit, 1866MHz, DOMINATOR with Airflow fan - $475
TR3X3G1866C9D - 3GB Kit, 1866MHz DOMINATOR with Airflow fan - $250
TR3X6G1600C8D - 6GB Kit, 1600MHz DOMINATOR - $300
TR3X3G1600C8D - 3GB Kit, 1600MHz DOMINATOR - $175
TR3X6G1333C9 - 6GB Kit, 1333MHz - $230
TR3X3G1333C9 - 3GB Kit 1333MHz - $120
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Windows Explorer caches DLLs (Dynamic-Link Libraries) in memory for a period of time after the application using them has been closed. This can be an inefficient use of memory.
Just follow the following steps:
Go to start then run then type "regedit" and press enter, then
1. Find the key [HKEY_LOCAL_MACHINE\SOFTWARE\Microsoft\Windows\CurrentVersion\Explorer].
2. Create a new DWORD sub-key named 'AlwaysUnloadDLL' and set the default value to equal '1' to disable Windows caching the DLL in memory.
3. Restart Windows for the change to take effect.Please keep in mind, that editing a registry can be dangerous if not properly implememted. So always save a backup of the registry before applying any registry tweaks.This site is not responsible for any malfunctioning of your system.
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Intel has begun shipping the X25E Extreme SATA SSD, which the company has proclaimed as its “highest performing SSD”. The 32GB SSD is based on Intel’s 50nm single-level cell (SLC) NAND flash memory technology.Intel claims that the X25E can increase the performance of servers, workstations, and storage systems by 100 times over hard drives, if measured in terms of Input/Output per Second (IOPS).
The 32GB SSD, which Intel claims can reduce energy costs by five times, boasts of 35,000 read IOPS and 3,300 write IOPS. The official press release pegged the maximum read speed at 250 MB/s and maximum write speeds at 170 MB/s respectively.The 32GB version is out now and carries a price tag of $695. The production of the 64GB version will begin in first quarter of 2009.
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OCZ Technology today unveiled the industry's first triple channel memory kit designed specifically for the impending Intel Core i7 processor / Intel X58 Express Chipset, available in 3GB and 6GB kits.The new memory modules are Optimized for the Core i7's triple channel mode, combining low voltage requirements, speed, and latency.
Developed for enthusiasts and early-adopters, the low voltage OCZ Triple Channel solutions are the choice counterparts for leading-edge performance that won't inhibit the functionality of Core i7 CPUs."OCZ engineered these 3GB and 6GB kits specifically for Intel's imminent platform," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "By using special-screened, low voltage-capable ICs, these modules are the perfect complement for the Intel X58 Chipset to deliver the maximum performance by enabling low latency settings and higher system frequency."The advanced memory modules offer clock speeds up to 1600MHz at just 1.65V memory voltage. Elpida memory has also anounced the development of DDR3 memory that match these specifications.
OCZ will release the triple channel kits under the Platinum and Gold series designed specifically for enthusiasts and gamers:
OCZ PC3-10666 Gold 3GB (3X1GB) 1333MHz CL 9-9-9-20 1.65V
OCZ PC3-10666 Gold 6GB (3X2GB) 1333MHz CL 9-9-9-20 1.65V
OCZ PC3-12800 Gold 3GB (3x1GB) 1600MHz DDR3 CL8-8-8-24 1.65V
OCZ PC3-12800 Gold 6GB (3x2GB) 1600MHz DDR3 CL8-8-8-24 1.65V
OCZ PC3-10666 Platinum 3GB (3x1GB) 1333MHz CL7-7-7-20 1.65V
OCZ PC3-10666 Platinum 6GB (3x2GB) 1333MHz CL7-7-7-20 1.65V
OCZ?s Triple Channel kits feature propriety XTC (Xtreme Thermal Convection) heatspreaders. The company has not provided pricing details.
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GIGABYTE proudly announces its revolutionary Ultra Durable 3 technology, first ever consumer desktop motherboard design to feature 2 ounces of copper for Power as well as Ground layers. Thus it delivers lower system temperature, improved energy efficiency and enhanced stability for overclocking.GIGABYTE’s innovative motherboard design with Ultra Durable 3 technology features double the amount of copper compared to traditional motherboard designs. Doubling the copper offers more effective solution by delivering efficient spreading of heat from critical areas of the motherboard. Twice the amount of copper also lowers the PCB impedance by 2X and lesser flow of current results into less energy wasted. It also provides improved signal quality, better system stability and allows greater margins for overclocking. The GIGABYTE Ultra Durable 3 motherboards deliver up to 50°C cooler working temperatures.
The GIGABYTE Ultra Durable 3 motherboards equip solid capacitors developed by leading Japanese manufacturers which offer an average lifespan of 50,000 hours. The capacitors provide stability, reliability and longevity that is essential to meet the power needs of high-end processors as well as other components.The Quick Boost Technology offers 3 levels of CPU performance enhancement and GIGABYTE’s Dynamic Energy Saver (DES) provides better energy saving capabilities. It also supports DDR2 1366+ Native Memory.
With GIGABYTE’s retooled Dynamic Energy Saver, overclockers can experience the benefits of multi-gear power phase switching while overclocking. It also offers ultra stable and ultra smooth overclocking performance.
The GIGABYTE Ultra Durable 3 motherboards are available through Avnet India, Ingram Micro and Redington. GA-EP45-UD3P is priced at Rs.15000, GA-EP45-UD3R for Rs.13000, GA-EP45-UD3 for Rs.11500, GA-EP45T-UD3P for Rs.15500 and GA-EP45T-UD3R for Rs.13,500.
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Now that mainstream users are starting to flock towards 64-bit desktops with 4GB of RAM, some enthusiasts will be looking for new ways to stay ahead of the curve. Luckily, memory makers
are right there with them. OCZ has introduced a batch of four new DDR2 memory kits that feature meaty 8GB and 16GB densities.
OCZ bases the kits on 4GB memory modules, so even the 16GB pack only features four DIMMs. Specs-wise, the firm isn't aiming for anything outlandish: all modules run at 800MHz, have CAS5 latencies, and only need a standard 1.8V of juice to function. Exact timings range from 5-4-4-18 on the "P45 Special" Platinum 8GB Edition to 5-6-6-18 for the "P45 Special" Vista Upgrade 16GB Quad Kit. OCZ is also launching 8GB Gold and 8GB Vista Upgrade kits.If you're wondering about the "P45 Special" in the product names, OCZ says it uses that label because the DIMMs are "optimized specifically for Intel's latest chipset." P45 or not, you'll probably want to double-check motherboard compatibility before splurging for these kits. Also, we should mention that memory support tops out at 16GB for Windows Vista Home Premium x64 and 8GB for Windows Vista Home Basic x64.
are right there with them. OCZ has introduced a batch of four new DDR2 memory kits that feature meaty 8GB and 16GB densities.OCZ bases the kits on 4GB memory modules, so even the 16GB pack only features four DIMMs. Specs-wise, the firm isn't aiming for anything outlandish: all modules run at 800MHz, have CAS5 latencies, and only need a standard 1.8V of juice to function. Exact timings range from 5-4-4-18 on the "P45 Special" Platinum 8GB Edition to 5-6-6-18 for the "P45 Special" Vista Upgrade 16GB Quad Kit. OCZ is also launching 8GB Gold and 8GB Vista Upgrade kits.If you're wondering about the "P45 Special" in the product names, OCZ says it uses that label because the DIMMs are "optimized specifically for Intel's latest chipset." P45 or not, you'll probably want to double-check motherboard compatibility before splurging for these kits. Also, we should mention that memory support tops out at 16GB for Windows Vista Home Premium x64 and 8GB for Windows Vista Home Basic x64.
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Intel Corporation and Micron Technology have introduced the industry's first sub-40 nanometer (nm) NAND memory device, unveiling a 34nm
32 gigabit (Gb) multi-level cell chip.This process technology was jointly developed by Intel and Micron and manufactured by the companies' NAND flash joint venture, IM Flash Technologies (IMFT). It is the smallest NAND process geometry on the market. The 32 Gb NAND chipis the only monolithic device at this density that fits into a standard 48-lead thin small-outline package (TSOP), providing a cost-effective path to higher densities in existing applications. Shipments of customer samples begin in June and mass production is expected during the second half of this year calendar.
"This new 32 Gb device provides the best bit storage density available in the industry," said Brian Shirley, vice president of Micron's Memory Group. "Together with our partners at Intel, we're proud to have now taken the lead in production process technology."
"The introduction of 34nm process technology highlights IMFT's rapid progress and moves us to the forefront of NAND process technology," said Pete Hazen, director of marketing, Intel NAND Products Group. "These advancements will expand the value proposition and accelerate the adoption of solid-state drive (SSD) solutions in computing platforms."
The 34nm 32 Gb chips will be manufactured on 300 millimeter wafers, each producing approximately 1.6 terabytes of NAND. Measuring just 172mm², less than the size of a thumbnail, the 34nm 32 Gb chip will cost-effectively enable high-density solid-state storage in small form factor applications.
A single 32 Gb chip could store more than 2,000 high-resolution digital photos or hold up to 1,000 songs on a personal music player. Two 8-die stacked packages would realize 64 gigabytes (GBs) of storage, enough for recording anywhere from eight to 40 hours of high-definition video in a digital camcorder.
The 34nm 32Gb chip was designed with solid-state drives in mind. The product will enable more cost-effective SSDs, instantly doubling the current storage volume of these devices and driving capacities to beyond 256 GBs in today's standard, smaller 1.8-inch form factor. SSDs are becoming the new storage medium for notebook computers, providing lower power, faster boot-up time, increased reliability, improved performance and reduced noise than hard disk drives. With the innovations in NAND process technology, such as with the 34nm NAND process, SSDs now offer a significant range of capacities to meet market requirements.
Based on the 34nm architecture, Intel and Micron also plan to introduce lower density multi-level cell products including single-level cell products, by the end of this year.
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When shopping for computer hardware, consumers tend to favor bigger numbers. I don't blame them, either. The average consumer knows about as much about hardware as I know about needlepoint, which is to say very little. Most, I would suspect, have no idea exactly what a megabyte is, let alone a gigahertz. But they can count, so when faced with the choice between 2GHz or 2.5GHz, they're going to go with the higher number. Because it's better.Except when it's not, as was the case with the Pentium 4. Intel architected the P4 to scale to higher clock speeds than we'd ever seen before, birthing a megahertz myth that conveniently exploited consumer ignorance. Why would Joe Sixpack buy an Athlon at a mere 1.4GHz when he could get a Pentium 4 at 2GHz? Enthusiasts knew the score, but for years, mainstream consumers were easily persuaded—if they hadn't assumed already—that the Pentium 4 was a far better processor because it had a higher clock speed. More recently, we've seen a much smaller but not less absurd memory myth take hold in the graphics card industry. Budget cards equipped with ridiculous amounts of memory are the culprit here. For enthusiasts, a gig of memory on a sub-$100 graphics card makes about as much sense as putting a spoiler on a Yugo. Budget GPUs lack the horsepower necessary to run games at the kinds of resolutions and detail levels that would require such a copious amount of video memory. But what about the latest crop of mid-range graphics cards? Nvidia's GeForce 8800 GT has considerable pixel-pushing power on its own, and when teamed in SLI, that power is effectively doubled. Perhaps a gigabyte of memory on this class of card isn't so unreasonable.
Conveniently, derivatives of the GeForce 8800 GT are available with 256MB, 512MB, or 1GB of memory, making it easy for us to probe the impact of graphics memory size on performance. We've tested a collection of single cards and SLI configurations in a selection of new games, across multiple resolutions, to see where memory size matters, if it does at all. Keep reading for the enlightening results. Bigger than yours
When Nvidia first introduced the GeForce 8800 GT, the card came equipped with 512MB of memory. Shortly thereafter, in response to AMD's launch of the Radeon HD 3850 256MB, the green team filled out the low end of the 8800 GT lineup with a cheaper 256MB variant. The 8800 GT's memory size didn't scale upward until graphics board makers started fiddling with the design on their own. Palit put 1GB of memory on its 8800GT Super+, releasing it to market alongside some of the most subversively phallic promotional shirts we've ever seen.
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These Settings will fine tune your systems memory management -at least 512MB of ram recommended go to start\run\regedit -and then to the following key
HKEY_LOCAL_MACHINE\SYSTEM\CurrentControlSet\Control\Session
Manager\Memory Management
1.Disable Paging Executive -double click it and in the decimal put a 1 - this allows XP to keep data in memory now instead of paging sections of ram to harddrive yeilds faster performance.
2.Large System Cache- double click it and change the decimal to 1 -this allows XP Kernel to Run in memory improves system performance alot
Reboot and watch your system fly ..happy tweakin Note: This tweak may cause problems with ATI cards *this is documented by ATI.For more information subscribe in the email.
HKEY_LOCAL_MACHINE\SYSTEM\CurrentControlSet\Control\Session
Manager\Memory Management
1.Disable Paging Executive -double click it and in the decimal put a 1 - this allows XP to keep data in memory now instead of paging sections of ram to harddrive yeilds faster performance.
2.Large System Cache- double click it and change the decimal to 1 -this allows XP Kernel to Run in memory improves system performance alot
Reboot and watch your system fly ..happy tweakin Note: This tweak may cause problems with ATI cards *this is documented by ATI.For more information subscribe in the email.
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As dapreview points out, this just-announced Cowon N3 looks quite like the Cowon Q5W we reviewed a few weeks ago. The most noticeable difference comes from the fact that this has a 7-inch screen as opposed to the Q5's 5-incher. Other than that, there's no internal memory—you have to use one of two SDHC slots to add storage—and GPS and DMB (portable TV) support. The good news is that this does support DivX/XviD and all the other video and audio codecs the Q5W does, meaning that you'll never have to go a second without entertainment.And here is the rest of it.
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