Transcend Information Inc. (Transcend®), a global leader in the manufacture of high performance memory modules, is proud to unveil 4GB aXeRam™ DDR3-1800 memory upgrade kits. Designed specifically for hard-core gamers using only top-binned, premium quality DRAM chips and custom high-purity aluminum heat sinks with cooling fins, aXeRam DDR3-1800 dual-channel kits deliver amazing high-speed overclocking performance while maintaining cool temperatures and rock-solid system stability.

Transcend’s 4GB aXeRam DDR3-1800 kit’s two identically-matched 240-pin unbuffered 2GB DDR3 1800MHz DIMMs are carefully paired for use in dual-channel configuration, which together provide memory bandwidth of up to 28.8GB/s. To ensure extra-stability and signal integrity at high clock speeds, all aXeRam modules use robust eight-layer PCBs that fully comply with JEDEC standards. The aXeRam 128Mx8 DDR3 DRAM chips are selected with the strictest quality and performance standards and are manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages toassure better thermal dissipation, electrical efficiency and improved overclocking performance. Transcend’s aXeRam DDR3-1800 modules also support new Intel® Extreme Memory Profile (XMP) technology, which allows users with high-performance motherboards to easily overclock their memory with aXerRam’s built-in aggressive speed-maximized profiles, or manually input their own memory timing parameters to take their system to the next level.

Specification:

* Memory Type: DDR3 Overclocking Memory
* Pin and Module Type: 240Pin Long-DIMM
* Frequency: DDR3-1800+
* Function: Unbuffer Non-ECC 8-8-8-24
* Capacity: 4GB
* DRAM: 128Mx8
* Voltage: 1.8 V
* CL: 8

Mushkin Enhanced, one of the leading manufacturers for High Performance Computer Parts announced today the release of its XP3-15000 DDR3 modules. Rated for 933MHz (1866MT/s data rate) and 8-9-8-24 latencies, the XP3-15000 modules provide astonishing performance on Intel X58 platforms while using a safe 1.65V supply voltage.

"Following our tradition of innovation in the high performance memory market, the new XP3-15000 brings Core i7 triple-channel kits to an elevated standard", said Brian Flood, Mushkin's director of product development. "Enthusiasts and gamers alike will enjoy the flexibility and stabilityof this new product while overclocking their machines."The XP3-15000 modules are immediately available on the mushkin-europe.com website in 3GB and 6GB triple-channel kits. Every module is hand-tested beyond its rated specification and features Mushkin's FrostByte heatspreader which keeps the modules within safe operating temperatures. Like all Mushkin products, the XP3-15000 modules are backed by an industry-leading technical support staff. With Mushkin you get more.

Technical Specifications

* Product Number: 998686 /998687
* Series: XP3
* RAM-type: DDR3 unbuffered
* Capacity: 3072/6144MB
* Kit: 3x 1GB/2GB
* Latency: 8-9-8-24
* Frequency: 1866MHz
* Voltage: 1.65V
* Heatspreader: Advanced FrostByte

A-DATA Technology Co. Ltd., a worldwide leading manufacturer in high performance memory products, announced today that its XPG DDR3 memory modules have broken a new world record on SuperPi 32m. The record was set by utilizing the DFI Lanparty UT X58 motherboard and XPG X Series v2.0 memory, the DDR3-2133X v2.0 2GBx3 triple-channel kit.
The SuperPi 32m record of 6min 40sec 360ms was achieved at a speed of 2237 MHz and latency settings of 8-7-7-21 using DDR3-2133X v2.0 2GBx3 triple-channel kit.The XPG DDR3-2133X v2.0 is engineered with heavy Aluminum heatspreaders and active dual-fan to keep the RAMs operate in low temperatureenvironment. Through the combination of the cooling methodology, the XPG DDR3-2133X v2.0 is able to maximize its OC performance. Moreover, it was awarded with the prestigious Taiwan Excellent 2009 Award for its distinctive design.

A-DATA X Series memory represents the ultimate overclocking performance. It was developed to unleash the hidden power of CPU and motherboard by using A-DATA’s latest overclocking IC sorting technology. A-DATA XPG modules are guaranteed to satisfy the needs of PC enthusiasts and overclockers for high-performance, compatibility, and stability on memory modules.

Transcend Information Inc has released its DDR3-1333 triple channel memory kits for use with Intel Core i7 processors and Intel X58 Express Chipset motherboards. Transcend’s triple channel kits are designed specifically for the new platform, and offer an optimized combination of low voltage (1.5V), speed and enhanced latency (9-9-9-24) to deliver suitable performance and compatibility with next-generation PCs.
Available in two different capacities of 3GB (1GBx3) and 6GB (2GBx3), Transcend’s DDR3-1333 triple channel memory kits’ three identically matched DDR3 modules are carefully matched for use in triple-channel configuration, which together provide memory bandwidth of up to 32GB/sec. To ensure extra-stability and signal integrity, all DDR3 modules use robust PCBs that fully comply with JEDEC standards.Each chip is manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages with extra contacts to assure better thermal dissipation, electrical efficiency and reliable computing quality.

Transcend memory modules are built to the highest specifications with the finest chips and materials available, and undergo rigorous testing to ensure they provide the best performance possible. All Transcend memory modules come with a lifetime warranty and the support of a global service network.

Lexar Media, a leading global provider of memory products for digital media, today announced the immediate availability of Ballistix DDR3-1333 (PC3-10600) and DDR3-1600 (PC3-12800) three channel DDR3 memory kits. These new kits support the latest Intel chipset technology, based on the Core i7 processors. Ballistix three channel DDR3 memory kits are available in 3GB and 6GB kits through select resellers and directly from Crucial's website.
The Ballistix name is synonymous with high-octane gaming; these new three channel products are designed with the latest Intel Extreme Memory Profiles (XMP) for pre-defined memory optimization. Intel's QuickPath architecture, which connects the memory directly to the processor as opposed to communicating through a separate chipset, enables faster memory throughput and performance. Enthusiasts can continue to count on Ballistix memory for some of the fastest, most responsive performance available.

"Ballistix memory is known for its extreme performance and our new three channel kits are an excellent fit for the new Core i7 platforms. By utilizing Intel's latest XMP specifications, we are delivering a product that willallow consumers to easily configure their memory for excellent performance," said Jeremy Mortenson, senior product marketing manager at Lexar Media. "Like all Ballistix memory, the new three channel Ballistix kits incorporate specially selected components that are 100% tested at the component and module level and are a desirable memory solution for achieving outstanding throughput and speed gains. Additionally, they carry a limited lifetime warranty and feature world-class service and support."

Crucial.com delivers over 250,000 memory upgrade solutions for more than 40,000 systems. With the addition of these new three channel memory kits, Crucial.com features a complete line of high-performance memory offerings at www.crucial.com/ballistix, www.crucial.com/uk/ballistix, and www.crucial.com/eu/ballistix.

Mushkin today announced a new DDR2 800 MHz, 2x 2GB dual-channel memory kit, the XP2 series model 996580X2. The product targeted at the mainstream thru value segments. Mushkin adopted a simplistic product design which includes two modules without heatspreaders. The modulesoperate at voltages between 2 and 2.1V and DRAM timings of 4-4-4-12. The modules use an 8-layer black coloured PCB to reduce electronic noise. Mushkin plans to sell this kit for 46 to 49 Euros including taxes.

Buffalo, known by the PC enthusiast community for their high-end FireStix series memory modules, is readying a new high-speed memory kit under the FireStix Inferno brand. The rated memory speed for these modules is at a blistering 1100 MHz (2200 MHz DDR) setting a speed standard of PC3-17600, a notch above the DDR3-2133 MHz kit on offer by Corsair.

Buffalo will sell these modules in a dual-channel kit (model: FSI2200D3K-K2G), consisting of two modules. Each module has a capacity of 1 GB. They featurealuminum heatsinks for passive cooling. The modules are rated to hit clock speeds of 2200 MHz with DRAM timings of 9-9-9-24, at a voltage of 2.1V. The company has started shipping the kit today, widespread availability is expected by January.

Memory-supremo Cosair already has itself a set of blazing-fast tri-channel DDR3 DOMINATOR modules operating at 1,866MHz, but now it's teasing something new...

Officially unveiled today and expected at retail in the "very near future" are a set of mean-looking modules that'll go by the name of DOMINATOR GT.

The kit, pictured below in tri-channel form for Intel's X58 platform, consists of three 2GB modules that'll hit 2,000MHz at just 1.65V with low latencies of 7-8-7-20. That's pretty damn fast, and the low voltageshould leave ample room for pushing these beauties a whole lot further.
We're almost certain to see benchmark-smashing results when these arrive on the scene, and though there's no mention of price just yet, they're likely to make holes in even the thickest of wallets. We'll take a guess and say $650 or more.

A-DATA Technology Co., Ltd., a worldwide leader in high performance memory products, announced the introduction of new enthusiast memory modules, the A-DATA XPG DDR3-2133X v2.0 kits, as part of the company's X series. The new high-performance modules are able to operate at incredible speeds of 2133MHz while featuring CL10-10-10-30 timings.

The company announced that the new A-DATA XPG DDR3-2133X v2.0 memory modules were available in 1GBx3/2GBx3 triple-channel as well as in 2GB/4GB dual-channel module kits. The new products have been designed with heavy Aluminum heatspreaders and an additional 50mm dual-fan unit, meant to keep the RAMs cool to deliver better performance levels, at a noise level of only 21.8dB. In addition, the combination of the two methods of heat dissipation is also meant to maximize theoverclocking performance of the A-DATA X Series Version 2.0.

The A-DATA X Series memory modules come to users as the ultimate choice for overclocking performance. They have been designed so as to be able to unleash the capabilities of both the CPU and the motherboard of the system through the use of the company's latest overclocking IC sorting technology. PC enthusiasts and gamers can rest assured that their needs for high-performance, compatibility, and stability will be fully covered by the new memory modules.

A-DATA has proven in time that it is capable of consistently delivering high quality to its users. The X Series Version 2.0 can offer stable operation over extended periods of usage, which is ensured by rigorous testing and screening on all components. The A-DATA XPG DDR3-2133X v2.0 memory kits feature high-quality 8-layer PCB (Printed Circuit Board), dual blue LED fan (3500RPM, 50mm), optimization for 64-bit OS, backward compatibility with DDR3-1600, 1333 and 1066, as well as lifetime limited warranty.

OCZ is said to be preparing for the launch of new triple-channe memory kits. The memory modules have not been announced yet, but word on the web says they are supposed to surface in the near future. The new kits will come as X58 loving Reaper parts and are said to be available as 3GB (3x1GB) and 6GB (3x2GB) kits, while working at 1866MHz.

According to the news on the Web, the fresh DDR3 Reaper Triple-channel kits will feature a slightly different design compared to the series, yet the change is rather insignificant, as there is still aheatsink connected to another smaller one via a heatpipe. The difference here would be that the new heatsink is made out of nickle-plated copper. The 1866MHz Reaper kits will feature 9-9-9-28 latencies and will work at 1.65Volts.

The same news also states that OCZ plans to launch a Platinum 6GB and 3GB triple-channel kits which are expected to feature the 1866MHz frequency, 9-9-9-28 latencies and 1.65Volts working voltage. The only problem would be that the Platinum kits will feature a smaller heatsink, generating higher operating temperatures and lower overclocking results than in the case of the Reaper series.

OCZ has made a name as a provider of high-performance reliable memory products, and the upcoming kits should fit just well in the company's commitment to provide the best solutions to its users. The X58 loving Reaper memory modules should be able to enhance the user experience of any owner of a Core i7 CPU and an X58 motherboard. As previously reported, the exact launch date has not been unveiled, yet the parts are expected to surface in the next few weeks. No information on the price of the kits has been disclosed either.

Crucial, a sub-division of Micron, recently released a new memory kit in its BallistiX Tracer series. The Crucial BallistiX Tracer PC3-10600 (1333MHz) is specifically built for performance enthusiasts and case modders who want to push the performance envelope while adding flash appeal to their boxes.
The Ballistix line of high-performance memory modules features advanced speed grades, low latencies, and integrated aluminum heat spreaders. Ballistix Tracer memory features a black PCB, black integrated heat spreaders, and one or two rows of eight "chasing" red and green LEDs atop the module, circulating in a random pattern based on memory utilization. A custom-designed circuit relays bus activity to the LEDs, allowing them to accurately reflect usage of each memory module. In addition, eight blue ground effects LEDs emit a constant glow near the pins.

What is a Ballistix Tracer DDR3 240-pin DIMM? Ballistix Tracer 240-pin DIMMs are found in DDR3 memory. DDR3 boasts an improved architecture allowing very fast data transmission.

A Ballistix Tracer dual inline memory module (DIMM) consists of a number of memory components attached to a black printed circuit board. Gold pins, found on the bottom of the DIMM, provide a connection between the module and a socket on a larger printed circuit board. The pins on the front and back of a DIMM are not connected to each other.

To use DDR3, your system motherboard must have 240-pin DIMM slots and a chipset that supports DDR3 — which is a different technology than that of than its predecessors, DDR2 and DDR. DDR3 incorporates different sockets; they are not interchangeable or backward-compatible. (Information about which memory technology your system uses is included in the Crucial Memory Advisor tool.)

The number of black components on a Ballistix Tracer 240-pin DIMM can vary, but it always has 120 pins on the front and 120 pins on the back, for a total of 240. Ballistix Tracer 240-pin DIMMs are approximately 5.25 inches long and 1.18 inches high, though the heights can vary. These 240-pin DDR3 DIMMs have only one notch within the row of pins, and each technology has the notch in a slightly different location on the module.

- Main features

* DDR3 PC3-10600
* 6-6-6-20
* Unbuffered
* NON-ECC
* DDR3-10600
* 1.80V
* 128Meg x 64