ince Intel launched the Atom platform the netbook market has significantly increased, providing users and PC vendors alike with a new computer category, specifically focused on delivering a rich Internet experience and on-the-go computing. However, the success level of the Atom processor might soon be overtaken by one of Intel's upcoming products, which is targeted at the growing market for Mobile Internet Devices. This will be an area where Intel's Moorestown chip will have to compete with some other chip makers, like ARM or VIA. However, the Santa Clara, California-based global leading chip maker is confident that its chip will succeed in surpassing those of its competitors.

In a recent news-article on the Inquirer, Pankaj Kedia, Intel's Director of the MID program, sat down and detailed his view on the company's MID platform. “Moorestown will give you the opportunity not only to experience the Internet in its full glory but will also have voice capability” said Kedia. He also added “I call it the ‘Next Smartphone’, the smart smartphone.”

The chip, according to Kedia, will be capable of providing the end-user with support for the Internet, gaming, personal navigation, multimedia and all of the features that you require from your everyday smartphone.

The Moorestown platform is slated for release next year, the first device being the fruit of the collaboration between the chip giant and LG Electronics. The two companies are currently collaboratingon the upcoming Moorestown-based LG MID running Moblin 2.0. Unfortunately, the exact details of when the MID will become available have not yet been disclosed.

In regard to the competition between Intel and ARM, Kedia said that, because Intel's platform would be based on x86 architecture, users would be able to fully benefit from the Internet experience, while the ARM architecture “is not compatible at the architectural level and is not compatible at the implementation level” said Kedia.

It is clear that Intel is planning its products to be in almost everything you own, which consequently means that other chip makers might have a tough time ahead of themselves, trying to compete with the Chipzilla.

Looking to capitalize on the new surge of Internet-based applications and innovations, Intel today announced that its architecture is well positioned to be at the core of new innovations and transformation, according to Intel executive Anand Chandrasekher.

"Technology innovation is the catalyst for new user experiences, industry collaborations and business models that together will shape the next 40 years," said Chandrasekher. "As the next billion people connect to and experience the Internet, significant opportunities lie in the power of technology and the development of purpose-built devices that deliver more targeted computing needs and experiences."

Based on these observations, Intel spoke about the Atom processor, the upcoming "Nehalem" processor, and the Intel "Moorestown" platform scheduled for the 2009-2010 timeframe. The company also highlighted the progress they are making in the Mobile Internet Devices (MID) market segment with the world's first working "Moorestown" platform demonstration.Moorestown comprises of an SOC, codenamed "Lincroft," which integrates the 45nm processor, graphics, memory controller and video encode/decode onto a single chip and an I/O hub codenamed "Langwell", which supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions.

Chandrasekher stated that Intel is on track to reduce Moorestown platform idle power by more than 10x compared to the first-generation MIDs based on the Intel Atom processor. He indicated that Moorestown platforms will support a range of wireless technologies including 3G, WiMAX, WiFi, GPS, Bluetooth and mobile TV.

Additionally, Chandrasekher announced collaboration with Ericsson for HSPA data modules optimized for the Moorestown platform. He also announced that Option is extending its collaboration for HSPA modules to the Moorestown platform. These 3G modules are 25x30x2.x mm in size, are optimized for Moorestown power requirements and will help provide MID users with always-on Internet-based experiences.

The company also provided details for the Intel Core i7 processor, launching next month.

At Computex last year, folks from VIA Technologies showed us an entire x86 PC motherboard no bigger than a business card. The board, which was based on VIA's Mobile-ITX form factor, combined a 600MHz VIA C7 processor and a single-chip chipset with integrated graphics.
At the ongoing Intel Developer Forum, Intel Ultra mobility group Senior VP and General Manager Anand Chandrasekhar has outdone VIA by presenting a motherboard that's even smaller than the Taiwanese company's Mobile-ITX product. As Engadget reports, Intel's board is designed to house Intel's upcoming Moorestown processor—the successor to Silverthorne—and it actually looks a little smaller than a credit card. The board Chandrasekhar showed wasn't populated with chips yet, but it's designed to accommodate a processor, chipset, 3G cellular radio, Wi-Fi controller, Bluetooth chip, GPS, and memory.Moorestown is scheduled for the 2009-2010 time frame, and according to Chandrasekhar's presentation (PDF), it will mark Intel's first entry into cell phone form factors. Intel expects Moorestown to trim idle power consumption tenfold compared to the Menlow platform, which Intel launched yesterday under the Centrino Mobile brand.