Team Group boasts tri-channel memory kit

By Koushik Saha on 9.12.08

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The Xtreem DDR3-2000 use the premium 8-layer PCB design and the genuine 128x8 chips in BGA package. With the exclusive sorting technology and repeated QA tests from Team, it is absolutely necessary that every Xtreem module can meet the strictest demands of worldwide
overclockers with the manufacturer’s uncompromising production and quality control. Moreover, every module must pass the burn-in test for at least 24 hours on a wide range of overclocking platforms made by ASUS and GIGABYTE to ensure flawless compatibility, reliability and performance of every module. The model are equipped with built-in EPP (Enhance performance profiles) features to# ensure that beginners can also enjoy the high-speed performance of the modules. The black aluminum heatsink that comes together with the modules marks the unearthly power of the Xtreem Series. # Compared with the Xtreem DDR3-1600, the Xtreem DDR3-2000 has increased the timing by nearly 40% and the single-channel bandwidth to 16GB/sec. More importantly, the Xtreem DDR3-2000 can fully display the timing parameter of 9-9-9-24 (tCL-tRCD-tRP-tRAS) at only 1.9V, which is a perfect match with the 2000MHz timing. In terms of capacity, besides the 4GB kit that meets the demand of power users, Team has launched the 2GB (2x1GB) kit for general overclockers. It will be the best choice for Power Users who can win the OC competition.
some of the specifications are :
Suitable for Desktop PCs
Module Type 240Pin Unbuffered DIMM Non ECC
DRAM Density 128x8
Capacity 4GB Kit (2x2GB)
Data transfer
bandwidth 16,000MB/Sec (PC3 16000)
CL-value 9-9-9-24-2T
Working voltage 1.9V
PCB 8-layer PCB
Extra features Aluminum heat-sink(4-6cm fan can be set-up on heat spreader by user request (optional)
Warranty Lifetime warranty

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